Solid Press-Fit Technology
Press-fit technology is a favorable alternative to conventional soldering on printed circuit board applications
In order to create a reliable press-fit connection, it is necessary for the pins of the press-fit component to have a minimal larger cross-sectional area than that of the hole in the board. During the press-fit process, the PCB is slightly deformed by the pin. The result is the creation of a gas-tight connection between the board and component, with very low resistance and high mechanical strength.
Consequently, solid press-fit technology is most notably suitable for high-current applications and for the use under adverse environmental conditions. The reasons for that are:
- Excellent electrical characteristics
- Lower impact of the PCB‘s PTH barrel on the press-fit zone
- Excellent mechanical properties of solid press-fit zone